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Plasma ashing

Known as: Ash (disambiguation) 
In semiconductor manufacturing plasma ashing is the process of removing the photoresist (light sensitive coating) from an etched wafer. Using a… 
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Related topics

Related topics

5 relations
Dry etchingEtching (microfabrication)Plasma cleaningSemiconductor

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
Biocompatible microfabricated magnetic cylinders as contrast agents for magnetic resonance imaging
This paper proposed a novel MEMS-based fabrication process for biocompatible, hollow cylindrical ferromagnetic contrast agents… 
2013
2013
Polymeric waveguide platform fabrication optimization
2013
2013
Effect of Oxygen Plasma on Low Dielectric Constant HSQ (Hydrogensilsesquioxane) Films
The commercially available hydrogensilsesquioxane (HSQ) offers a low dielectric constant. In this paper, the impact of oxygen… 
2010
2010
Minimization of plasma ashing damage to OSG low-k dielectrics
This paper investigated the plasma ashing damage to patterned porous low k structures with the objective to minimize the plasma… 
2006
2006
Heat, moisture and chemical resistance on low dielectric constant (low-k) film using Diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor deposition
2005
2005
Effects of Oxygen Plasma Ashing on Barrier Dielectric SiCN Film
Effects of oxygen plasma ashing on barrier dielectric SiCN films have been studied for various ashing conditions. According to X… 
2004
2004
Evaluation of Automated Urinary Iodine Methods : Problems of Intertering Substances
We evaluated automated methods for measurement of unnary iodine (UI) over a range expected in iodine-replete and iodine… 
2004
2004
Condensation of silanol groups in porous methylsilsesquioxane films using Supercritical CO/sub 2/ and alcohol cosolvents
Fourier transform infrared (FTIR) spectroscopy, goniometry, and electrical measurements were used to investigate the effect of… 
2002
2002
Preventing dielectric damage of low-k organic siloxane by passivation treatment
2001
2001
The effect of ammonia plasma treatment on low-k methyl-hybrido-silsesquioxane against photoresist stripping damage
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