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Lift-off (microtechnology)
Known as:
Lift Off Process
Lift-off process in microstructuring technology is a method of creating structures (patterning) of a target material on the surface of a substrate (e…
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Related topics
Related topics
5 relations
Etching (microfabrication)
Ohmic contact
Sputter deposition
Wafer (electronics)
Broader (1)
Semiconductor device fabrication
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Flexible Quasi-Vertical In-Ga-Zn-O Thin-Film Transistor With 300-nm Channel Length
L. Petti
,
A. Frutiger
,
+5 authors
G. Troster
IEEE Electron Device Letters
2015
Corpus ID: 43987689
In this letter, we report a flexible Indium-Gallium-Zinc-Oxide quasi-vertical thin-film transistor (QVTFT) with 300-nm channel…
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2013
2013
Releasing high aspect ratio SU-8 microstructures using AZ photoresist as a sacrificial layer on metallized Si substrates
K. Lau
,
A. Giridhar
,
S. Harikrishnan
,
N. Satyanarayana
,
S. Sinha
2013
Corpus ID: 33754814
This paper presents a successful method for releasing high aspect ratio SU-8 micro-structures by the use of positive photoresist…
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2012
2012
Selective area growth of a- and c-plane GaN nanocolumns by molecular beam epitaxy using colloidal nanolithography
A. Bengoechea-Encabo
,
S. Albert
,
+8 authors
E. Calleja
2012
Corpus ID: 44092777
Highly Cited
2010
Highly Cited
2010
Fabrication and Characterization of a Parylene-Based Three-Dimensional Microelectrode Array for Use in Retinal Prosthesis
Renxin Wang
,
Xian Huang
,
Guangfeng Liu
,
Wei Wang
,
Fangtian Dong
,
Zhihong Li
Journal of microelectromechanical systems
2010
Corpus ID: 21789457
A novel Parylene-based shape-transferring technique was developed to fabricate 3-D microelectrodes, which fulfilled the…
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2010
2010
A high concentration photovoltaic module utilizing micro-transfer printing and surface mount technology
B. Furman
,
E. Menard
,
+9 authors
S. Burroughs
35th IEEE Photovoltaic Specialists Conference
2010
Corpus ID: 5987415
We describe a high concentration photovoltaic (CPV) module utilizing micro-transfer printed (µ-TP) dual-junction GaInP/GaAs solar…
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2008
2008
Bilayer processing for an enhanced organic-electrode contact in ultrathin bottom contact organic transistors
Jeongwon Park
,
R. Yang
,
+5 authors
A. Kummel
2008
Corpus ID: 122073030
A bilayer lift-off process has been employed to fabricate optimal electrode contact geometry for statistical characterization of…
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2006
2006
Ordered Arrays of Mesoporous Microrods from Recyclable Macroporous Silicon Templates
X. Chen
,
M. Steinhart
,
C. Hess
,
U. Gösele
2006
Corpus ID: 40011987
Ordered mesoporous materials fabricated by exploiting self-assembled surfactants as molecular templates have been intensively…
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2006
2006
High-temperature 434 MHz surface acoustic wave devices based on GaPO/sub 4/
M. Hamidon
,
V. Skarda
,
+4 authors
W. Buff
IEEE Transactions on Ultrasonics, Ferroelectrics…
2006
Corpus ID: 20689179
Research into surface acoustic wave (SAW) devices began in the early 1970s and led to the development of high performance, small…
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Highly Cited
2001
Highly Cited
2001
Patterning nonflat substrates with a low pressure, room temperature, imprint lithography process
M. Colburn
,
A. Grot
,
+5 authors
C. Willson
2001
Corpus ID: 30706204
Step and flash imprint lithography (SFIL) is a technique that has the potential to replace photolithography for patterning resist…
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1993
1993
Sub-50 nm high aspect-ratio silicon pillars, ridges, and trenches fabricated using ultrahigh resolution electron beam lithography and reactive ion etching
P. Fischer
,
S. Chou
1993
Corpus ID: 6710769
We present the fabrication of sub‐50 nm Si pillars, ridges, and trenches with aspect ratios greater than 10 using ultrahigh…
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