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Through-silicon via

Known as: TSV, Through silicon via, Through-silicon via (TSV) 
In electronic engineering, a through-silicon via (TSV) is a vertical electrical connection (via) passing completely through a silicon wafer or die… 
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Related topics

Related topics

16 relations
Back-illuminated sensorDeep reactive-ion etchingDie (integrated circuit)Electrical connection

Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Reliability Challenges Related to TSV Integration and 3-D Stacking
This article identifies four major reliability challenges related to TSV-based 3-D integrated circuits and their solutions that… 
Highly Cited
2011
Highly Cited
2011
How to select adhesive materials for temporary bonding and de-bonding of 200mm and 300mm thin-wafer handling for 3D IC integration?
Handling and shipping thin wafers (≦200μm) through all the semiconductor fabrication and packaging assembly processes are very… 
Highly Cited
2010
Highly Cited
2010
An efficient distributed memory interface for many-core platform with 3D stacked DRAM
Historically, processor performance has increased at a much faster rate than that of main memory and up-coming NoC-based many… 
2009
2009
Through silicon via (TSV) equalizer
Through silicon via (TSV) is a promising vertical interconnection method to achieve a 3-dimensional integrated circuit (3D IC… 
2009
2009
Through Silicon Via stress characterization
In this paper, we will present Micro Raman stress data of Through Silicon Vias (TSV) with different shapes and sizes & spacing… 
2009
2009
A 3D prototyping chip based on a wafer-level stacking technology
We have developed a new 3-dimensional stacking technology using wafer-to-wafer stacked method and evaluated the connectivity… 
Review
2008
Review
2008
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
As traditional CMOS scaling becomes progressively more difficult and less beneficial to overall system performance, three… 
Highly Cited
2008
Highly Cited
2008
Through-silicon via and die stacking technologies for microsystems-integration
The highest integration density of microsystems can be obtained using a 3D-stacking approach, where each layer of the stack is… 
2006
2006
Proposal of novel statistic channel model for millimeter wave WPAN
A statistic channel model, TSV-model: Shoji, Sawada, Saleh (Triple S), and Valenzuela model, was newly developed to design 60-GHz… 
1998
1998
Ein Tabu Search-Verfahren für Containerbeladeprobleme mit schwach heterogenem Kistenvorrat
ZusammenfassungGegenstand des Beitrags ist die Entwicklung eines Tabu Search-Verfahrens (TSV) für Containerbeladeprobleme mit… 
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