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Thermosonic bonding

Thermosonic Bonding is widely used to permanently wire bond integrated circuits into computers. It was introduced by Alexander Coucoulas in the 1960s… 
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Related topics

Related topics

9 relations
Alexander CoucoulasCentral processing unitCompliant bondingFlip chip

Papers overview

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2012
2012
Study on flow behavior of BCB in adhesive bonding aiming at reducing transverse deformation
This paper presents a novel method to investigate the flow behavior of Benzocyclobutene (BCB) in adhesive bonding process, both… 
2010
2010
Chip on Glass Interconnection using Lateral Thermosonic Bonding Technology
In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding… 
2008
2008
Composite-copper, low-thermal-resistance heat sinks for laser-diode bars, mini-bars and single-emitter devices
Here we present characteristic performance of laser-diode devices employing a novel CTE-matched heatsink technology (where CTE is… 
2007
2007
A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding
Microstructures and microtextures of the gold wire, free air ball, Au stud bumps and flip chip bonding bumps were analyzed using… 
2006
2006
Nonlinear behaviors of transducer dynamics for thermosonic bonding
  • Lei HanJ. Zhong
  • Conference on High Density Microsystem Design and…
  • 2006
  • Corpus ID: 25700624
Energy for deformation, metamorphism and interconnection of metals, is mainly from high frequency pressure/shear loads via a PZT… 
2006
2006
Effects of thermosonic bonding parameters on flip chip LEDs
The effects of thermosonic bonding parameters on GaN-based light emitting diodes (LEDs) with flip chip structure were… 
2006
2006
APreliminary EBSDStudyofMicrostructures andMicrotextures Evolution during AuStudandFlip- chip Thermosonic Bonding
Microstructures andmicrotextures oftheAu bumpsafter ballbonding and flip-chip bonding wereanalyzed using electron backscatter… 
2004
2004
Studies of microstructure characteristics and evolutions at the bond interface in bonding technology
To enhance thermosonic bond development, an improved understanding is needed of the processes taking place at the bond interface… 
2002
2002
A MEMS socket system for high density SoC interconnection
The design of a microelectromechanical systems (MEMS) socket system to enable the temporary high density interconnection of a… 
1995
1995
Thermosonic bonding for flip-chip assembly
Thermosonic flip-chip bonding is a new, solderless technology for area-array connections. Its simple, clean, and dry process may… 
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