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Texas Instruments SN76477
Known as:
SN 76477
, SN-76477
, SN76477
SN76477 "complex sound generator" was a sound chip produced by Texas Instruments (TI). The chip came to market in 1978, and TI production of the part…
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Related topics
Related topics
4 relations
Arcade game
Dual in-line package
Sound chip
Texas Instruments SN76489
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Effect of interfacial reaction on tin whisker formation of Sn/Ni films deposited on copper lead-frame
Ting Liu
,
D. Ding
,
Yu Hu
,
Y. Gong
International Conference on Electronic Packaging…
2014
Corpus ID: 17171241
Ni film electroplated between matte tin film and Cu-based lead-frame was used as a diffusion barrier to prevent whisker formation…
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2009
2009
The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders
M. Shimoda
,
N. Hidaka
,
M. Yamashita
,
K. Sakaue
,
T. Ogawa
Electronic Packaging Technology Conference
2009
Corpus ID: 35046554
Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently…
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2008
2008
Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
I. Shohji
,
H. Watanabe
,
T. Okashita
,
Tsutomu Osawa
2008
Corpus ID: 59436133
The impact properties of solder ball joints with Sn-Ag-Cu-Ni-Ge lead-free solders and Cu electrodes were investigated in the aged…
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2007
2007
Adesão ao tratamento medicamentoso de pacientes com doenças inflamatórias intestinais acompanhados no ambulatório de um hospital universitário
Nathalie de Lourdes de Sousa Dewulf
,
R. A. Monteiro
,
Afonso Dinis Costa Passos
,
Elizabeth Meloni Vieira
,
L. E. A. Troncon
2007
Corpus ID: 72490543
BACKGROUND: Compliance to drug therapy is important for a successful treatment. Although many studies have assessed compliance to…
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2005
2005
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
X. Dai
,
Ning Pan
,
+4 authors
T. Michalka
Proceedings Electronic Components and Technology…
2005
Corpus ID: 36155351
For high performance computer system applications, there are limitations for reliably and cost effectively attaching high I/O…
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2005
2005
Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
P. Limaye
,
B. Vandevelde
,
B. Verlinden
,
D. Vandepitte
2005
Corpus ID: 138468290
1996
1996
Martingale Restrictions on Equilibrium Prices of Arrow-Debreu Securities Under Rational Expectations and Consistent Beliefs
P. Bossaerts
1996
Corpus ID: 15795061
Consider the Rational Expectations price history of an Arrow-Debreu security that matures in the money: p1; p2; …; pr. Past…
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1980
1980
ESR studies of low water content 1,2-dipalmitoyl-sn-glycero-3-phosphocholine in oriented multilayers. 1. Evidence for long-range cooperative chain distortions
E. Meirovitch
,
J. Freed
1980
Corpus ID: 19767872
ESR studies on a variety of spinprobes incorporated into 1,2-dipalmitoyl-sn-glycero-2-phosphocholine (DPPC) bilayers are reported…
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1977
1977
Protein-Mediated Transfer of Phosphatidylcholine to Myelin
E. Carey
,
P. C. Foster
1977
Corpus ID: 89451737
demonstrate that the conformation of the peptide is sensitive to this minor thermal transition. However, the monotonic decrease…
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Review
1975
Review
1975
Scintiphotography in Evaluation of Renal Transplants
H. Haden
1975
Corpus ID: 55705373
Renal -transplantation has progressed from the research stage to become a standard clinical procedure. Although still generally…
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