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Mixed flowing gas
Mixed flowing gas (MFG) is a type of laboratory environmental testing for products, particularly electronics, to evaluate resistance to corrosion due…
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Environmental chamber
Environmental tests
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Galvanic corrosion of silicon-based thin films: A case study of a MEMS microphone
M. Broas
,
J. Li
,
+4 authors
M. Paulasto-Krockel
Electronic Components and Technology Conference
2015
Corpus ID: 41147188
MEMS microphones are widely utilized in commercial applications such as mobile phones and laptops. Microphones cannot be sealed…
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2014
2014
Creep corrosion test in flowers of sulfur chamber
H. Fu
,
Prabjit Singh
,
Jing Zhang
International Conference on Electronics Packaging
2014
Corpus ID: 23660749
Creep corrosion is the corrosion of the copper (and sometimes silver) metallization on PCBs and the creeping of the corrosion…
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2012
2012
New Corrosion Resistant Plating to Reduce Gold Consumption in Connectors
G. Chou
IEEE 58th Holm Conference on Electrical Contacts…
2012
Corpus ID: 7620202
A new plating structure consisting of a seal layer on top of copper substrate and beneath a conventional gold/nickel finish shows…
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2006
2006
Assessment of Ni/Pd/Au–Pd and Ni/Pd/Au–Ag Preplated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests
P. Zhao
,
M. Pecht
,
Sung-Cheul Kang
,
S. Park
IEEE transactions on components and packaging…
2006
Corpus ID: 11768104
Preplated leadframes packages with a new noble metal finish type were exposed to various electrochemical migration tests, and…
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2006
2006
Biased mixed flowing gas testing for world class reliability
G. Derkits
,
J. Franey
,
W. Reents
Bell Labs technical journal
2006
Corpus ID: 37434044
The reliability of complex installed systems is a function of many variables, including those inherent in the operating…
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2005
2005
Mixed flowing gas studies of creep corrosion on plastic encapsulated microcircuit packages with noble metal pre-plated leadframes
Ping Zhao
,
M. Pecht
IEEE transactions on device and materials…
2005
Corpus ID: 44209808
This paper describes tests and analysis of creep corrosion on plastic encapsulated electronic components with Ni/Pd or Ni/Pd/Au…
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2003
2003
Diffusion and absorption of corrosive gases in electronic encapsulants
C. Hillman
,
B. Castillo
,
M. Pecht
Microelectronics and reliability
2003
Corpus ID: 15835625
2003
2003
Effects of Lead-Free Surface Finishes on Press-Fit Connections
R. Hilty
2003
Corpus ID: 17600235
For decades, tin-lead has been used as the primary surface finish for compliant pins and plated through holes (PTH) of printed…
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2003
2003
Field failure due to creep corrosion on components with palladium pre-plated leadframes
P. Zhao
,
M. Pecht
Microelectronics and reliability
2003
Corpus ID: 30939048
1991
1991
Evaluation of a mixed flowing gas test
J. Chao
,
R. Gore
Electrical Contacts - Proceedings of the Thirty…
1991
Corpus ID: 21540237
The results of a process to better understand the IBM GIT gaseous corrosion test are presented. Previous work over the past two…
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