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Intel QuickPath Interconnect

Known as: Intel QPI, Common Serial Interconnection, QPI interface 
The Intel QuickPath Interconnect (QPI) is a point-to-point processor interconnect developed by Intel which replaced the front-side bus (FSB) in Xeon… 
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Related topics

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ArrandaleBroadwell (microarchitecture)ChipsetDEC Alpha

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing
Electromigration (EM) has been considered to be the major reliability issue for current and future VLSI technologies. Current EM… 
2016
2016
Optics vs. copper — From the perspective of Thunderbolt 3 interconnect technology
"Thunderbolt 3" has adopt both copper and optical interconnect technologies, depends on the cable length used. Single cable can… 
Highly Cited
2009
Highly Cited
2009
A family of 45nm IA processors
Nehalem is a family of next-generation IA processors for mobile, desktop and server segments implemented in 45nm high-κ metal… 
2009
2009
Monolithic graphene nanoribbon electronics for interconnect performance improvement
In this paper, multi-layer graphene nanoribbon (GNR) is proposed as an emerging interconnect solution, which can be integrated… 
2005
2005
On the outage capacity of MIMO multihop networks
In this paper we discuss the outage capacity of multihop networks employing terminals with multiple antennas. We discuss the… 
2005
2005
SR ARQ for adaptive modulation systems combined with selection transmit diversity
Adaptive automatic repeat request (ARQ) schemes are quite effective for throughput enhancement in time-varying mobile channel… 
Review
2002
Review
2002
On-chip inductance cons and pros
  • Y. Ismail
  • IEEE Transactions on Very Large Scale Integration…
  • 2002
  • Corpus ID: 6560683
Provides a high level survey of the increasing effects of on-chip inductance. These effects are classified into desirable and… 
2000
2000
Power chip interconnection : From wire bonding to area bonding
Inside the state-of-the-art power devices and power modules, interconnection of power devices is accomplished with wirebonds… 
1994
1994
Dielectric materials for advanced VLSI and ULSI technologies
Advancements in very-large-scale integration (VISI) and ultra-large-scale integration (ULSI) of semiconductor devices result in… 
1992
1992
Multiprotocol Interconnect on X.25 and ISDN in the Packet Mode
This document specifies the encapsulation of IP and other network layer protocols over X.25 networks, in accordance and alignment… 
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